Material selection, process tolerances,
manufacturing logistics, and your flex supplier all play an
important role in producing a cost-effective and reliable flex
circuit design.
At Rushpcb will assist you in design for
manufacturing to minimize overall program costs. Listed are
standard materials and capabilities.
Come speak with us
should your design require tighter tolerances or special
process treatments.
| Material
Selection |
| Polyimide Thickness |
0.0005" (12 um), 0.001" (25 um), 0.002"
(50 um), 0.003"
(75 um), 0.005" (125 um) |
| Copper (thickness) |
0.25 oz.(9 um), 0.33 oz.(12 um), 0.5 oz. (17
um), 1 oz.(35 um), 2 oz.(70 um) |
Copper Foils
(rolled-annealed) |
Polyimide, Polyester, LPI (liquid photo imageable),
PIC(photo imageable cover coat) |
| Stiffeners |
FR-4, Polyimide, Metal, or customer supplied |
| Thermo-bond Adhesives |
Acrylic, Phenolic Butyral, Modified Epoxy |
| Surface Finishes |
Solder (hot air leveling or tin/lead plating), Electrolytic
Soft Bondable Gold, Hard Gold, ENIG (electro less nickel
immersion gold), Entek 106A, & Immersion Tin |
| Process Capabilities and
Tolerances |
| Minimum Trace/Space |
0.0015"/.002" (0.33 oz.)
0.002"/.0025" (0.5 oz.)
0.003"/.0035" (1 oz.) |
| Minimum Via Hole Diameter (before plating) |
0.006" (NC Drill)
0.002" (UV Laser) |
| Minimum Blind Via Diameter (before plating) |
0.004" (UV Laser) |
| Trace to Edge Distance |
0.010" ( NC Route )
0.008" (Die Punch)
0.001" (UV Laser)* |
| Trace to Edge Tolerance |
0.005" ( NC Route )
0.003" (Die Punch)
0.001" (UV Laser) |
| Cover Layer Aperture Positional Tolerance |
0.005" (Cover Film)
0.002" (LPI and PIC)
0.001" (Laser Ablation)** |
*Trace to edge distance should be greater than
0.003" for proper copper insulation
** Laser defined
apertures created by ablating cover layer
material |
