Finish |
|
HASL (Hot Air
Solder
Leveled) |
Solder is deposited on features that are
not covered with Solder Mask. Solder Thickness varies from 0.2
to 1.2 mils. This variation is due to board circuit density,
aspect ratio. Solder consists of 63%/37% eutectic Tin/lead |
| OSP (Organic Solder ability Preservative) |
A transparent organic coating is deposited
on features that are not covered with solder mask. |
| ENIG (Electrolyses Nickel/Gold) |
Electrolyses nickel and Electrolyses gold
is deposited on features that are not covered with Solder
Mask. Thickness for Nickel is between 80 to 150 micro inches
and Gold thickness is 3-6 micro inches. |
| Gold Flash |
Electrolytic nickel-gold deposited on
solder able features. Typically 150-200 micro inches of nickel
is deposited, and 5-10 micro inches of Hard gold. Gold flash
is applied to features after pattern Copper plating. |
| Immersion Silver |
Silver is deposited on features not covered
with solder mask. Thickness of silver is 4 to 20 micro inches. |
| White Tin |
Immersion tin is deposited on features not
covered with Solder mask. Thickness is typically 30-40 micro
inches. |
Carbon Ink for
Key pad application |
A conductive carbon paste is applied on
selective pads for contact purposes, e.g.. Keypads of
calculators, etc. |
Wire Bondable
Soft Gold |
Electrolytic soft gold is plated on
features that require bondable gold for wire bonding
application. Depending on the type of wire bonding used, the
thickness of gold varies from 20 to 50 micro inches. Nickel
thickness is between 150 to 250 micro
inches. |
